BSC440N10NS3 G
$(*'#$%TM3 Power-Transistor
Product Summary
Features
:
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VDS
100
V
RDS(on),max
44
m#
ID
18
A
: # (!,,% * ,- 0+ !**% 4% *
PG-TDSON-8
: 6# % **% ,2 '!2% # (!0'% 6R DS(on) product (FOM)
:
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:
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1)
for target application
: !*- '% , &0% % !# # - 0$ ),' 2-
Type
Package
Marking
BSC440N10NS3 G
PG-TDSON-8
440N10NS
Maximum ratings, at T j=25 °C, unless otherwise specified
Parameter
Symbol Conditions
Continuous drain current
ID
Value
T C=25 °C
18
T C=100 °C
11
T A=25 °C,
R thJA=50 K/W 2)
5.3
Unit
A
Pulsed drain current3)
I D,pulse
T C=25 °C
72
Avalanche energy, single pulse
E AS
I D=12 A, R GS=25 #
18
mJ
Gate source voltage
V GS
±20
V
Power dissipation
P tot
29
W
Operating and storage temperature
T j, T stg
-55 ... 150
°C
T C=25 °C
IEC climatic category; DIN IEC 68-1
Rev. 2.4
55/150/56
page 1
2009-10-30
BSC440N10NS3 G
Parameter
Values
Symbol Conditions
Unit
min.
typ.
max.
-
-
4.3
-
-
50
100
-
-
Thermal characteristics
Thermal resistance, junction - case
R thJC
Thermal resistance,
junction - ambient
R thJA
6 cm2 cooling area2)
K/W
Electrical characteristics, at T j=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
V (BR)DSS V GS=0 V, I D=1 mA
Gate threshold voltage
V GS(th)
V DS=V GS, I D=12 µA
2
2.7
3.5
Zero gate voltage drain current
I DSS
V DS=100 V, V GS=0 V,
T j=25 °C
-
0.01
1
V DS=100 V, V GS=0 V,
T j=125 °C
-
10
100
V
µA
Gate-source leakage current
I GSS
V GS=20 V, V DS=0 V
-
1
100
nA
Drain-source on-state resistance
R DS(on)
V GS=10 V, I D=12 A
-
38
44
m#
V GS=6 V, I D=6 A
-
48.3
86
-
0.8
-
#
8
15
-
S
Gate resistance
RG
Transconductance
g fs
1)
|V DS|>2|I D|R DS(on)max,
I D=12 A
J-STD20 and JESD22
2)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
3)
see figure 3
Rev. 2.4
page 2
2009-10-30
BSC440N10NS3 G
Parameter
Values
Symbol Conditions
Unit
min.
typ.
max.
-
610
810
-
120
160
Dynamic characteristics
Input capacitance
C iss
Output capacitance
C oss
Reverse transfer capacitance
C rss
-
6
-
Turn-on delay time
t d(on)
-
9
-
Rise time
tr
-
3
-
Turn-off delay time
t d(off)
-
13
-
Fall time
tf
-
3
-
Gate to source charge
Q gs
-
2.7
-
Gate to drain charge
Q gd
-
1.3
-
Switching charge
Q sw
-
2.2
-
Gate charge total
Qg
-
8.1
10.8
Gate plateau voltage
V plateau
-
4.5
-
Output charge
Q oss
-
12
16
nC
-
-
18
A
-
-
72
-
0.9
1.2
V
-
44
-
ns
-
61
-
nC
V GS=0 V, V DS=50 V,
f =1 MHz
V DD=50 V, V GS=10 V,
I D=6 A, R G=1.6 #
pF
ns
Gate Charge Characteristics4)
V DD=50 V, I D=6 A,
V GS=0 to 10 V
V DD=50 V, V GS=0 V
nC
V
Reverse Diode
Diode continous forward current
IS
Diode pulse current
I S,pulse
Diode forward voltage
V SD
Reverse recovery time
t rr
Reverse recovery charge
Q rr
4)
T C=25 °C
V GS=0 V, I F=18 A,
T j=25 °C
V R=50 V, I F=6 A,
di F/dt =100 A/µs
See figure 16 for gate charge parameter definition
Rev. 2.4
page 3
2009-10-30
BSC440N10NS3 G
2 Drain current
P tot=f(T C)
I D=f(T C); V GS;
40
20
30
15
ID [A]
Ptot [W]
1 Power dissipation
20
10
10
5
0
0
0
40
80
120
160
0
40
80
TC [°C]
120
160
TC [°C]
3 Safe operating area
4 Max. transient thermal impedance
I D=f(V DS); T C=25 °C; D =0
Z thJC=f(t p)
parameter: t p
parameter: D =t p/T
103
101
102
100 ns
0.5
ZthJC [K/W]
1 µs
ID [A]
10 µs
101
100 µs
0.2
100
0.1
1 ms
0.05
DC
0.02
100
0.01
single pulse
10-1
10-1
10-1
100
101
102
103
VDS [V]
Rev. 2.4
tp [s]
page 4
2009-10-30
BSC440N10NS3 G
5 Typ. output characteristics
6 Typ. drain-source on resistance
I D=f(V DS); T j=25 °C
R DS(on)=f(I D); T j=25 °C
parameter: V GS
parameter: V GS
50
70
5V
60
40
5.5 V
6V
10 V
50
30
RDS(on) [m ]
7V
ID [A]
6V
20
5.5 V
7V
40
10 V
30
20
5V
10
10
4.5 V
0
0
0
1
2
3
0
10
20
VDS [V]
30
40
50
60
20
25
30
ID [A]
7 Typ. transfer characteristics
8 Typ. forward transconductance
I D=f(V GS); |V DS|>2|I D|R DS(on)max
g fs=f(I D); T j=25 °C
parameter: T j
40
30
25
30
gfs [S]
ID [A]
20
20
15
10
10
5
150 °C
25 °C
0
0
0
2
4
6
VGS [V]
Rev. 2.4
0
5
10
15
ID [A]
page 5
2009-10-30
BSC440N10NS3 G
9 Drain-source on-state resistance
10 Typ. gate threshold voltage
R DS(on)=f(T j); I D=12 A; V GS=10 V
V GS(th)=f(T j); V GS=V DS
parameter: I D
90
4
80
3.5
70
3
120 µA
2.5
98 %
50
VGS(th) [V]
RDS(on) [m ]
60
typ
40
12 µA
2
1.5
30
1
20
0.5
10
0
0
-60
-20
20
60
100
140
180
-60
-20
20
Tj [°C]
60
100
140
180
Tj [°C]
11 Typ. capacitances
12 Forward characteristics of reverse diode
C =f(V DS); V GS=0 V; f =1 MHz
I F=f(V SD)
parameter: T j
104
1000
103
Ciss
100
IF [A]
C [pF]
Coss
102
25 °C
150 °C
10
101
150 °C, 98%
Crss
25 °C, 98%
100
1
0
20
40
60
80
VDS [V]
Rev. 2.4
0
0.5
1
1.5
2
VSD [V]
page 6
2009-10-30
BSC440N10NS3 G
13 Avalanche characteristics
14 Typ. gate charge
I AS=f(t AV); R GS=25 #
V GS=f(Q gate); I D=6 A pulsed
parameter: T j(start)
parameter: V DD
10
80 V
8
50 V
VGS [V]
6
20 V
4
2
0
0
2
4
Qgate [nC]
15 Drain-source breakdown voltage
16 Gate charge waveforms
V BR(DSS)=f(T j); I D=1 mA
110
VBR(DSS) [V]
105
100
95
90
-60
-20
20
60
Tj [°C]
100
140
180
6
8
BSC440N10NS3 G
Package Outline: PG-TDSON-8
Rev. 2.4
page 8
2009-10-30
BSC440N10NS3 G
Dimensions in mm
Rev. 2.4
page 9
2009-10-30
BSC440N10NS3 G
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Rev. 2.4
page 10
2009-10-30